Hong Kong Polytechnic University Global Service-Learning Scheme
The Gephardt Institute is accepting applications for Hong Kong Polytechnic University’s (PolyU) summer 2017 Global Service-Learning Scheme (GSLS). The GSLS provides students with the opportunity to partner with students from University Social Responsibility Network (USRN) institutions and student exchange partners of PolyU while serving in a cross-cultural context. We will nominate a team of three students who are interested in joining one of four service projects. Each project will start in Hong Kong and include trips to Cambodia or China.
Selected awardees will participate in the same project and be granted a scholarship of up to $2,500 each to cover expenses including flights, accommodations, meals, visas, and insurance.
Awardees will be required to:
- Attend and participate in any applicable pre-trip training in Hong Kong
- Actively participate throughout the service trip
- Stay with the PolyU team throughout the service trip and follow the regulations and instructions set by the project leaders to ensure personal safety and the quality of service delivered
- Complete pre- and post-questionnaires, feedback form, and final report/reflective journals
- Communicate with the project leaders and complete other requirements related to the chosen service project
Service-learning project options include:
- Technology beyond borders – Cambodia solar power
- Growing resilience of children in post-disaster area – Sichuan
- Promotion of children and adolescent development – Shanghai
- Promotion of children and adolescent development – Hangzhou
To download the application, click here. Applications will be reviewed on a rolling basis and are due on March 24.
For more information on the application process, email Tim Dugan, Coordinator of Student Engagement and Service for the Gephardt Institute, at email@example.com. For questions on the visa process, email Martha Turner, Director for International Student and Scholar Advising, at firstname.lastname@example.org.